Jpn. J. Appl. Phys. 44 (2005) pp. 5732-5735 |Previous Article| |Next Article| |Table of Contents|
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Anti-Sticking Effect of Organic Dielectric Formed by Electrodeposition in Microelectromechanical-System Structures
Tomomi Sakata,
Hiromu Ishii,
Yuichi Okabe,
Masao Nagase1,
Toshikazu Kamei2,
Kazuhisa Kudou2,
Masaki Yano2 and
Katsuyuki Machida
NTT Microsystem Integration Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
1NTT Basic Research Laboratories, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
2NTT Advanced Technology Corporation, 3-1 Morinosato Wakamiya, Atsugi, Kanagawa 243-0198, Japan
(Received November 15, 2004; accepted April 21, 2005; published July 26, 2005)
In microelectromechanical-system (MEMS) structures, selective encapsulation with an organic dielectric using electrodeposition can prevent sticking. Selective electrodeposition characteristics were investigated on a gold surface using sulfonium cations with epoxy groups as a source material. We observed an incubation period in the initial stage of the deposition. X-ray photoelectron spectroscopy revealed that the cause of the incubation period is the removal of oxygen adsorbed on the gold surface. Applying this technique to the encapsulation of MEMS structures confirmed the anti-sticking effect between an actuator and a gold electrode selectively coated with an organic dielectric.
KEYWORDS:
anti-sticking, organic dielectric, electrodeposition, MEMS
URL:
http://jjap.ipap.jp/link?JJAP/44/5732/
DOI: 10.1143/JJAP.44.5732
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