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Carbon Multiprobe on a Si Cantilever for Pseudo-Metal–Oxide–Semiconductor Field-Effect-Transistor
Masao Nagase,
Kenichiro Nakamatsu1,2,
Shinji Matsui1,2,
Hideo Namatsu and
Hiroshi Yamaguchi
NTT Basic Research Laboratories, NTT Corporation, 3-1, Morinosato-Wakamiya, Atsugi, Kanagawa 243-0198, Japan
1LASTI, Graduate School of Science, University of Hyogo, 3-1-2 Koto, Kamigori, Ako, Hyogo 678-1205, Japan
2CREST, JST, Kawaguchi Center Building, 4-1-8 Honcho, Kawaguchi, Saitama 332-0012, Japan
(Received July 4, 2005; accepted August 19, 2005; published online March 27, 2006)
A newly developed scanning probe microscopy system with multiple probes has been applied to measurements of local electrical properties of semiconductor films. Carbon multiprobes fabricated by focused ion beam deposition on a Si cantilever were used for source and drain electrodes on a pseudo-silicon-on-insulator (SOI) metal–oxide–semiconductor (MOS) field-effect-transistor (FET) on which the Si substrate and buried oxide (BOX) act as a gate electrode and gate insulator, respectively. The pseudo-MOSFET characteristics of a 10-nm-thick Si layer on an SOI substrate were successfully measured using the multiprobe. Furthermore, a carbon film deposited by electron cyclotron resonance (ECR) plasma sputtering on a Si substrate with an oxide layer was confirmed as a semiconductor for the first time, using the pseudo-FET method with a carbon multiprobe. The results clearly demonstrate that this multiprobe system can be a powerful and widely applicable tool for measuring local device characteristics of electrical materials.
KEYWORDS:
scanning probe microscopy, multiprobe, carbon probe, nanospring, cantilever, focused ion beam, pseudo-MOSFET, nanotechnology, FIB deposition, nano-electromechanical system, SOI, ECR sputtered carbon
URL:
http://jjap.ipap.jp/link?JJAP/45/2009/
DOI: 10.1143/JJAP.45.2009
- S. T. Liu, P. S. Fechner and R. L. Roisen: Proc. IEEE SOS/SOI Technology Conf., 1990, p. 61.
- S. Cristoloveanu and S. Williams:
IEEE Electron Device Lett. 13 (1992) 102[CrossRef].
- S. Cristoloveanu, D. Munteanu and S. T. Liu:
IEEE Trans. Electron Devices 47 (2000) 1018[CrossRef].
- S. Matsui, T. Kaitio, J. Fujita, M. Komuro, K. Kanda and Y. Haruyama:
J. Vac. Sci. Technol. B 18 (2000) 3181[AIP Scitation].
- T. Morita, K. Nakamatsu, K. Kanda, Y. Haruyama, K. Kondo, T. Hoshino, T. Kaitio, J. Fujita, T. Ichihashi, M. Ishida, Y. Ochiai, T. Tajima and S. Matsui:
J. Vac. Sci. Technol. B 22 (2004) 3137[AIP Scitation].
- M. Nagase, K. Nakamatsu, S. Matsui and H. Namatsu:
Jpn. J. Appl. Phys. 44 (2005) 5409[IPAP].
- M. Nagase, H. Takahashi, Y. Shirakawabe and H. Namatsu:
Jpn. J. Appl. Phys. 42 (2003) 4856[IPAP].
- M. Nagase and H. Namatsu:
Jpn. J. Appl. Phys. 43 (2004) 4624[IPAP].
- S. Hirono, S. Umemura, M. Tomita and R. Kaneko:
Appl. Phys. Lett. 80 (2002) 425[AIP Scitation].
- K. S. Novoselov, A. K. Geim, S. V. Morozov, D. Jiang, Y. Zhang, S. V. Dubonos, I. V. Grigorieva and A. A. Firsov: Science 306 (2004) 666[Science].